Bed Temperature
Heated bed temperature for a given filament — controls first layer adhesion, warping tendency, and part release.
Medium priority
Filament-Specific
What It Is
Bed temperature controls how warm the print surface is. It affects adhesion (too cold = won’t stick, too hot = won’t release), warping (proper bed temp reduces thermal stress), and first layer quality.
What It Controls
- First layer adhesion strength
- Warping tendency (thermal stress between bed and upper layers)
- Part removal difficulty (too hot = part fuses to surface)
- Bottom surface finish
Why It Varies
- Material requirements differ dramatically (PLA: 50-60°C, ABS: 90-110°C, PETG: 70-85°C)
- Print surface type affects ideal temperature (PEI, glass, BuildTak)
- Ambient temperature and enclosure affect heat loss
- Part geometry (large flat parts warp more, need higher bed temp)
How to Calibrate (Manual)
- Start with filament manufacturer recommendation
- Print adhesion test squares at different temperatures
- Check: does the part stick during printing? Does it release when cooled?
- Check for warping on larger test prints
- Find the sweet spot between adhesion and easy release
How the Auto-Tuner Calibrates It
- Strain gauge for adhesion force measurement — quantify adhesion at different temps
- Camera for warp detection — monitor first layer and early layers for lifting
- Tests adhesion vs. release tradeoff systematically
Related Anomalies
- Warping — bed temp too low for the material
- Adhesion Failure — bed temp too low
- Elephant Foot — bed temp too high softens first layers